CC2564C: CC2564 CC2564A CC2564B DSBGA Package Thermal Resistance data..

Newman

Part Number: CC2564C
Other Parts Discussed in Thread: CC2564,

Hi Team CC2564,

Looks like:

1. The CC2564A/B datasheet (https://www.ti.com/lit/ds/symlink/cc2564.pdf ) does not have any package thermal resistance data.

2. The CC2564C datasheet only has it for the VQFN package and not the DSBGA package.

I am looking for the CC2564 Thermal Resistance data for the DSBGA package..

Thanks, Merril

over 4 years ago

0 Vincent Rodriguez over 4 years ago

TI__Mastermind 28285 points

Hi Merril,

Give me 24 hours to look into this and get back to you.

BR,

Vince

0 Newman over 4 years ago

TI__Expert 6005 points

Hi Vince,

Any update? Thanks!

0 Oscar Sanchez over 4 years ago in reply to Newman

TI__Prodigy 725 points

Merril,

You want the data for the WCSP BGA device correct, not the QFN? I will need to check with the packaging team.

Regards,

Oscar

0 Newman over 4 years ago in reply to Oscar Sanchez

TI__Expert 6005 points

Hi Oscar,

Yes.. but while you are searching.. maybe get all the data you can..

Thanks, Merril

0 Newman over 4 years ago

TI__Expert 6005 points

Hi Oscar,

And the package of interest (in the 3P module) is the WCSP-54.

Thx, Merril

0 Oscar Sanchez over 4 years ago

TI__Prodigy 725 points

Merrill,

okay, I'm checking on the WCSP data.

Regards,

Oscar

0 Newman over 4 years ago

TI__Expert 6005 points

Hi Oscar,

Any update?

Thanks, Merril

0 Oscar Sanchez over 4 years ago in reply to Newman

TI__Prodigy 725 points

Merrill,

I had to submit request to the packaging team and could take up to 2 weeks for them to complete.

Regards,

Oscar

Bluetooth®︎

Bluetooth forum

CC2564C: CC2564 CC2564A CC2564B DSBGA Package Thermal Resistance data..