CC1352R: Disable GAP Bond Manager and SNV to Save Flash Space

Peter Crowley

Part Number: CC1352R
Other Parts Discussed in Thread: SYSCONFIG, BLE-STACK

Hello,

I am wondering how to disable the GAP Bond Manager and SNV in a BLE Peripheral project to save precious flash space on the CC1352.
My project is a BLE Peripheral device based on the dmm_154sensor_remote_display_oad_app example.

Bond Manager

This post suggests that the bond manager cannot be strictly disabled through SysConfig, but the desired result can be achieved by setting Pairing Mode: Pairing is not allowed.
https://e2e.ti.com/support/wireless-connectivity/bluetooth-group/bluetooth/f/bluetooth-forum/857814/ccs-cc2642r-disable-gap-bond-manager-in-sysconfig

Does this option remove Bond Manager code from the image to save flash space? If not, how can I do that?

SNV

Since my project does not require the Bond Manager, I would also like to disable the internal non-volatile flash storage driver.
I have attempted to do this by setting the No Osal SNV option under BLE -> Advanced Settings within SysConfig. Unfortunately, I still see a call to NVOCMP_initNvApi() from osal_snv_init() during boot.

Is there some way that I can ensure the stack (and thus osal_snv_init()) is being rebuilt with the NO_OSAL_SNV option that SysConfig defines in ti_ble_app_config.opt?

Thanks in advance for your help!
Peter

over 4 years ago

0 AndresM over 4 years ago

TI__Expert 3886 points

Hi Peter,

I've assigned someone to this thread. They should be able to help you shortly.

BR,
Andres

0 Marie H over 4 years ago

TI__Guru* 82431 points

Hi Peter,

First of all, did you see the section in the BLE-Stack User's Guide?

https://dev.ti.com/tirex/content/simplelink_cc13x2_26x2_sdk_5_20_00_52/docs/ble5stack/ble_user_guide/html/ble-stack-5.x/creating-a-custom-bluetooth-low-energy-application-cc13x2_26x2.html#optimizing-bluetooth-low-energy-stack-memory-usage

When it comes to sysconfig, configurations there only apply to the sysconfig generated files. Symbols defined in the sysconfig generated files can then affect the rest of the code.

For bond manager, I am not sure whether setting pairing mode not allowed will free up your flash. You can test in the following way:

1. Build your project.

2. Open the Memory Allocation view and note the flash occupation.

3. Make the change in sysconfig and rebuild the project.

4. Check the flash occupation again and see whether you have more flash available.

You can do the same regarding SNV.

Cheers,

Marie H.

+1 Marie H over 4 years ago

TI__Guru* 82431 points

Hi Peter,

Actually we have a section in the user's guide about removing this functionality:

Cheers,

Marie H.

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CC1352R: Disable GAP Bond Manager and SNV to Save Flash Space