We still use the bluetooth module LMX9838 in some of our older generation products. Currently there is a high failure rate in production lead back to faulty bluetooth modules. After inspection with x-ray we discovered massive solder depots which seem to short the pads of the xtal oscillator and/or short the load capacitors (see picture below).
We also separated the molded housing with a scalpel from the pcb and after inspection with a microscope we could confirm our first guess (see picture below).
So this raises the question: Are there any production problems related to the LMX9838 known by TI that might relate to our observation?