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CC2540 Mini Develpment Kit and Bonding (secure connection)

krishan singh
Prodigy 60 points
Other Parts Discussed in Thread: CC2540

Hello All,

After going thru the code, I saw that bonding (bond manager) can not be enabled for master device in the demo codes.

Is there any way to establish a secure connection using the CC2540 USB dongle.

I saw the GAP_Bond command in the Btool but its not able to establish a bond with another device. 

The GAP_Bond command always fails with status, 0x06(InvalidEventID) with Btool dump as

-----------------------------------------------------------------------------------------------
[3] : <Rx> - 05:33:44.394
-Type  : 0x04 (Event)
-EventCode : 0xFF (HCI_LE_ExtEvent)
-Data Length : 0x05 bytes(s)
 Event  : 0x060E (Unknown Op Code)
 Status  : 0x06 (InvalidEventId)
 Raw  : 06 00 00
Dump(Rx):
04 FF 05 0E 06 06 00 00

 

Please advise how to enable the Bond Manager for Master role device or use GAP_Bond command or any other way to establish a secure connection.

thanks

-krishan

 

 

 

  • 0
    TI__Genius 17975 points

    The current bond manager only supports peripheral devices. Our next software, BLEv1.1 (which will be released this summer), will include an updated bond manager that will support both central and peripheral role devices.