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solution for BT2.1 + ANT+ + BLE

Albin Zhang
Expert 6060 points
Other Parts Discussed in Thread: CC2564, CC2560, CC2567, CC2540, CC2570

Dear,

I have a customer. They have a project for sports/medical.  

They need BTH+ANT+ in this stage. And once the BLE standard is in place, they also want to add BLE in the device. They hope it can be upgrade without PCB changing, i.e. just change the PAN module or LPRF chip.

Could you give a solution?

My question is:

1.       Are these modules drop-in P2P compatible? PAN1315, PAN1317 and PAN1316. As my understanding, CC2560, CC2567 and CC2564 should be the same SOC, so the schematic/layout should be the same with external parts. right?

2.       Is that possible to implement BT, ANT+ and BLE in one SOC and PS/Profile in one MCU in the future?

3.       If 2# item can’t be done, how to implement the coexistence between two parts? I suppose TI already have solution in one part because anyway it is same RF PHY.

4.       Do you think PAN1317/27 + CC2540 is a right direction? Or PAN1315 + CC2570, then, they can change PAN1315 to PAN1316 to support BLE later.

Please give your expertise with considering the RD difficulty and cost.

Thanks you very much!

 

BR. Albin Zhang

 PS. can someone help move the topic to Bluetooth Application formus? I think i put it into a wrong formus.

  • 0
    TI__Mastermind 23565 points

    Albin,

             Currently, we have BT(only) and BT+ANT solutions. BT+BLE is coming in the near future. BT+BLE+ANT is not a solution we plan to support. Could you elaborate on the use case your customer is looking at, please?

             Regarding your questions, see below:

    1.       Are these modules drop-in P2P compatible? PAN1315, PAN1317 and PAN1316. As my understanding, CC2560, CC2567 and CC2564 should be the same SOC, so the schematic/layout should be the same with external parts. right?

    [MS]: Yes, CC256x devices are pin to pin compatible.

    2.       Is that possible to implement BT, ANT+ and BLE in one SOC and PS/Profile in one MCU in the future?

    [MS]: BT+ANT solution is available today (see www.ti.com/connectivitywiki ). BT+ANT+BLE is not planned.

    3.       If 2# item can’t be done, how to implement the coexistence between two parts? I suppose TI already have solution in one part because anyway it is same RF PHY.

    [MS]: Available BT+ANT solution handles coexistence.

    4.       Do you think PAN1317/27 + CC2540 is a right direction? Or PAN1315 + CC2570, then, they can change PAN1315 to PAN1316 to support BLE later.

    [MS]: If the three are needed, I would go with the BT+ANT solution on one side and the BLE chip separate to take advantage of the Bluetooth AFH mechanism. But it will also depend on the use cases they would like to operate.

    Please give your expertise with considering the RD difficulty and cost.

    Thanks you very much!