CC2652R7: Pairing/Bonding API's

Hi Madhusudhan,

I would recommend referencing the BLE Security Fundamentals SLA lab. This lab contains useful information with regards to bonding and pairing that I believe will help you during your project's development. I would also suggest referencing the GAP Bond Manager and LE Secure Connections section of the User's Guide. The Privacy chapter may also be helpful. With regards to the provided questions, please see below:

Madhusudhan K said:

1. How to check if a device is bonded or not ?

After a bond is formed, the bonding information is stored and can be accessed in SNV. Three events are also generated that can be used to track this: When the connection is formed the following events are received by the application GAPBOND_PAIRING_STATE_COMPLETE, GAPBOND_PAIRING_STATE_BOND_SAVED, and GAPBOND_PAIRING_STATE_ENCRYPTED. Please reference the API guide for the exact conditions in which these events are generated.

Madhusudhan K said:

2. How to retrieve the list of bonded devices ?

The User's Guide chapters referenced earlier in this response contains information that will help you retrieve the list of bonded devices. Please reference the Resolving Listd section of the User's Guide.

Madhusudhan K said:

3. How to delete a particular bond ?

The Resolving List section should contain information that is helpful here. I would also recommend referencing the GAPBOND_ERASE_SINGLEBOND and the following E2E thread: https://e2e.ti.com/support/wireless-connectivity/bluetooth-group/bluetooth/f/bluetooth-forum/470586/how-to-erase-single-bonding

Madhusudhan K said:

4. Is the bonding done automatically after pairing ?

Bonding must be enabled first. I believe the previously referenced BLE Security Fundamentals Lab and as well as the referenced main chapters in the User's Guide may be helpful in providing more details.

Best Regards,

Jan