CC2340R5: CC2340 packaging problem

wangrenli

Part Number: CC2340R5
Other Parts Discussed in Thread: SYSCONFIG,

I use a chip with 4*4 package (CC2340R5RGE), but the package selected in the project syscfg is 5*5(CC2340R5RKP), and only the pins owned by 4*4 are used. Will this affect it?

over 2 years ago

0 Ryan Brown1 over 2 years ago

TI__Guru**** 217707 points

Hi wangrenli,

Although this could be acceptable, I recommend that you consult Using the RGE QFN24 package variant from the BLE5-Stack User's Guide to migrate the SysConfig project properly and ensure the correct device operation.

Regards,
Ryan

0 wangrenli over 2 years ago in reply to Ryan Brown1

Intellectual 690 points

Hi.

The purpose of my doing this is that the same project can be applied to QFN24 or QFN40 chips by changing a macro definition, because they only have different pin definitions. So I chose the largest QFN40 as the package of syscfg, and the program uses different packaged pins according to this macro. Is there a better way?

0 Ryan Brown1 over 2 years ago in reply to wangrenli

TI__Guru**** 217707 points

Here are the differences in layout between the two packages:

Given the changing locations of various antenna and voltage source pins, I highly recommend that you have two separate projects and output binaries for each footprint. TI does not validate using a CC2340R5 RKP project on a RGE device, which is why migration instructions were provided.

Regards,
Ryan

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CC2340R5: CC2340 packaging problem