Other Parts Discussed in Thread: CC2650
Hello,
I'm running into flash size issues with our project using the CC2650MODA, and i'm looking to confirm a few things that I didn't find recent or definitive answers to in the forums. toolchain and versions:
ble_sdk_2_02_07_06
tirtos_cc13xx_cc26xx_2_21_01_08
xdctools_3_32_00_06_core
- I'd just like to confirm for the cc2650 it isn't possible to build the OAD example apps (specifically the simple_peripheral external flash) without NO_ROM set? It seems that the RCFG section has to be in the first page. That is a tool chain limitation correct? I see in new sdk versions like this: https://software-dl.ti.com/simplelink/esd/simplelink_cc2640r2_sdk/5.30.00.03/exports/docs/ble5stack/ble_user_guide/html/ble-stack-common/memory_map.html#ti-rtos-rom-jump-table that limitation has been somewhat addressed. Is there any possibility of getting some support to try setting that up for the cc2650?
- Along those same lines, am I using the most recent tools for this chip?
- Is it possible to use the spi driver from driverlib in the BIM first page (Bim_ext_flash example) in the BLE application? Switching from the non-OAD to OAD_Ext_Flash versions of the simple_peripheral example project adds quite a bit of flash space. When I first switched, I was getting a SPI_config missing symbol (I removed that from the board file for our custom hardware) so I assume at least some of that extra space is more RTOS driver in flash.
- Finally, there are no plans to make a CC2650MODA style module for a chip similar to the 2650 correct? For example the CC2652R since it has much more flash space. Is the 2650 the only chip that does come as a module?
Thanks,
Sam