Other Parts Discussed in Thread: CC2650
I have multiple options that I am evaluating for this, and I am breaking them down into multiple posts. These posts may appear similar at first, but they have separate questions.
I am taking on the task of updating an existing product where we may need to replace the existing Bluetooth module (which is based on the CC2640F128). This project is only using BLE, and we are not adding any features even if we move to a chip/module that supports more features.
One goal of this update is to keep the redesign effort to a minimum. If we change to a different module, that will require a PCB redesign for the new footprint. If we change to a different BT chip, that will require porting or rewriting the code that runs on the BT module.
One thing that's not 100% clear is what we absolutely need to update to qualify for the BT SIG certification.
I believe that we have 2 options that I would also like to understand, from a TI perspective. Both of these options would not require us to do any PCB modifications and would, therefore, be very appealing from a cost perspective. They are both based around using 3rd-party modules that are built around TI CC2640F128 and CC2640R2 chips.
One option would be to actually keep using our current CC2640F128 module which I believe has a withdrawn QDID (66911). To certify this with the BT SIG, could we use the component QDIDs 176642 and 118740 to qualify the product? If so, what testing would that require?
Another option would be to switch to a footprint-compatible module which is based on the CC2640R2. This module's QDID (96853) seems to be out of the 3-year window. To certify this with the BT SIG, could we use the component QDIDs 176642 and 118740 to qualify the product? If so, what testing would that require?