Other Parts Discussed in Thread: SYSCONFIG
SDK: simplelink_cc13xx_cc26xx_sdk_7_10_02_23
I am following the BLE5-Stack User's Guide to extract bonding information in simple_peripheral to aquire the IRK. I followed the "Extract Bonding Information" chapter to call
gapBondMgrReadBondRec() in SimplePeripheral_processPairState -> case GAPBOND_PAIRING_STATE_BOND_SAVED, the IRK was successfully displayed after bonding with a cellphone.
But when the cellphone disconnected with the peripheral, the peripheral entered Error_raiseX. The ROV showed that an Hwi exception occured:
I'm not sure what caused this issue. Please help review my code changes and suggest if my implementation has a problem or the stack has an issue under this use case. I attached my simple_peripheral.c as below. I also disabled the "Send Parameter Update Request" option in SysConfig to make it quicker to bond.
Best regards,
Shuyang