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LAUNCHXL-CC1352P: LAUNCHXL-CC1352P

Keenan Emmanuel
Prodigy 10 points
Part Number: LAUNCHXL-CC1352P
Other Parts Discussed in Thread: CC1352P

We are working on adding BLE support to an existing project and the device will assume a peripheral role. Our main issue is that including the BLE stack in our project will increase the flash usage to above acceptable levels as we still need memory for OTA upgrades. Furthermore, the download time for the OTA update image will be too long via the mechanism we are constrained to use if the files size increases dramatically.

One of the proposed solutions is to keep the BLE stack in a reserved portion of flash and never update this,  the rest of flash can be divided for the rest of application and OTA update images. Before attempting this solution, we would like to know if the loader will support such an OTA update?.

  • 0
    TI__Mastermind 24960 points

    Hi Emmanuel,

    From what I understand, you are not going to be using our OAD mechanism, which is bim + simple_peripheral_oad_onchip, is that right?

    I am wondering about which bootloader you are using then, can you clarify?

    By the way, on the CC13x0 series, we used to do just what you described.

    Regards,

    Arthur

  • 0 in reply to Arthur R☑️
    Prodigy 10 points

    Hi Arthur, thank you for your response, I was indeed referring to the BIM however the OTA will  be done over a sub-gig network not via BLE. I did read through the documentation, however I am not certain that the BIM supports the case where only user application is upgraded for an on-chip solution.

    Furthermore, if we do decide on a custom bootloader to handle this operation, which may be the case as we can not have the device being out of operation during an OTA update, how difficult is it to separate the BLE stack from the rest of application,  are there any examples or documentation that can point me in the right direction? 

  • +1 in reply to Keenan Emmanuel
    TI__Mastermind 24960 points

    Hi Emmanuel,

    Thanks for the info. Unfortunately, it is actually not possible to separate the BLE stack from the application.

    Given that you want to update an existing product, do you mean that it already has the hardware layout for the 2.4 GHz part of the PCB, or are you going to have to redesign it? In which case, I would suggest adding an external SPI flash, and use bim_offchip.

    Regards,

    Arthur

  • 0 in reply to Arthur R☑️
    Prodigy 10 points

    Hi Arthur, the hardware has been configured for 2.4ghz support.  Could you provide further detail on why it is not possible to separate the BLE stack? In the OAD documentation there are references to a application only upgrade , a stack + application upgrade etc, does this not refer to the BLE stack ? In which case it would theoretically be possible to split the images into application only and stack only.

  • 0 in reply to Keenan Emmanuel
    TI__Mastermind 24960 points

    Hi Emmanuel,

    Which OAD documentation are you looking at, can you please send me a link to it?

    As I said, this is possible to do on the CC13x0_CC26x0 series, as those have a smaller FLASH memory.

    But we do not have the same capability on the CC13x2, as the linking process between ROM, FLASH and the stack is different there.

    Regards,

    Arthur

  • 0 in reply to Arthur R☑️
    Prodigy 10 points

    Hi Arthur,

    Understood, I can see that the documentation I was reading would apply to both the CC13x0 series as well as the CC13x2 series hence the confusion.  

    However, just to clarify our proposal would be that the application still be monolithic, however memory would be reserved for the BLE stack , this area will never be changed by subsequent OTA updates. This would of course entail manually updating the linker but still should theoretically be possible?

    The link to the documentation can be found below

    https://dev.ti.com/tirex/explore/node?node=A__AORV2P9xKyaQCr.Dunw8Rg__com.ti.SIMPLELINK_CC13XX_CC26XX_SDK__BSEc4rl__LATEST . 

  • +1 in reply to Keenan Emmanuel
    TI__Mastermind 24960 points

    Hi Emmanuel,

    As far as I know, we have never tried doing that, so we cannot confirm anything on that.

    I would recommend you to try it out.

    Regards,

    Arthur

  • 0 in reply to Arthur R☑️
    Prodigy 10 points

    Thank you Arthur, it would have been good if split image OAD was possible for the CC1352p as well as the BLE stack is quite large, or if the microBLE stack was available for this device. Perhaps something for future development.