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CC2340R5:About BMS(Bond Management Service) of BLE service

Masaki
Prodigy 110 points
Part Number: CC2340R5

Hi,

I would like to incorporate the BMS (Bond Management Service) of the BLE service mentioned above into the device I am developing.


So my question is, does CC2340 support BMS?　Also, do you have any sample code?　

If you know, please let me know.

About BMS
https://www.bluetooth.com/ja-jp/specifications/bms-1-0-1/

Best regards, Masaki

  • +1
    TI__Genius 15535 points

    Hello Masaki,

    Thanks for reaching out.

    May I ask what SDK you are using?

    We have the GAP Bond Manager (GAPBondMgr), which is a configurable module that offloads most of the Pairing & Bonding security mechanisms associated with the Security Manager (SM). The basic_ble example inside the SDK (<SDK>\examples\rtos\LP_EM_CC2340R5\ble5stack) implements function that require the GAP bond manager. You can look into the functions inside the gapbondmgr.c file (found inside <SDK>\\source\ti\ble5stack_flash\host).

    Please let me know if this is what you are looking for.

    BR,

    David.

  • 0 in reply to David
    Prodigy 110 points

    Hi David,

    I'm currently using SDK sdk_7_40_00_64.

    Thank you for sharing information about GAP Bond Manager. There are three functions that I would like to achieve with BMS.

    ①Delete all device bonding information
    ②Delete all bonding information except for connected devices
    ③Delete the bonding information of the connected host device

    Of these, ① and ② seem to be possible with GAP Bond Manager.
    I looked at GAP Bond Manager to see if it was possible to achieve ③, but it didn't seem to be possible. Is there a function like ③ in the SDK?

    Best regards, Masaki

  • 0 in reply to Masaki
    TI__Genius 15535 points

    Hello Masaki,

    Would GAPBOND_ERASE_SINGLEBOND work for this puspose? You can read about it here: GAP Bond Manager Parameters

    BR,

    David.

  • 0 in reply to David
    Prodigy 110 points

    Hello David

    I tried it on a model equipped with GAPBOND_ERASE_SINGLEBOND, but ③ did not work.

    Regarding the BMS that I asked about, it is no longer necessary to install it in devices currently under development.

    So I would like to mark this as resolved for now.

    Thank you for providing information such as GAP Bond Manager.

    Best regards, Masaki