CC2651R3SIPA: Does CC2651R3SIPAT0MOUR support Bluetooth Bonding?

Will Jarrett

Intellectual 2885 points

Part Number: CC2651R3SIPA

Tool/software:

Hi team,

Does CC2651R3SIPAT0MOUR support Bluetooth Bonding? Can you share how this works? Thank you.

-Will

1 month ago

0 Jan 1 month ago

TI__Mastermind 34400 points

Hi Will,

Yes the CC2651R3SIPA along with all of the other BLE devices supported by the F2 SDK support Bluetooth LE pairing and bonding. This is all handled automatically by the BLE5-Stack and the bond manager. For more information, i highly recommend referencing the following resources:

https://dev.ti.com/tirex/content/cc13xx_cc26xx_simplelink_academy_7_41_00_00/_build_cc13xx_cc26xx_simplelink_academy_7_41_00_00/source/ble5stack/ble_02_security/ble_02_sec_funds.html

https://dev.ti.com/tirex/content/cc13xx_cc26xx_simplelink_academy_7_41_00_00/_build_cc13xx_cc26xx_simplelink_academy_7_41_00_00/source/ble5stack/ble_advanced_security/ble_sec_adv.html

https://dev.ti.com/tirex/content/simplelink_cc13xx_cc26xx_sdk_7_41_00_17/docs/ble5stack/ble_user_guide/html/ble-stack-5.x/privacy.html

https://dev.ti.com/tirex/content/simplelink_cc13xx_cc26xx_sdk_7_41_00_17/docs/ble5stack/ble_user_guide/html/ble-stack-5.x/gapbondmngr-cc13xx_cc26xx.html

Best Regards,

Jan

Bluetooth®︎

Bluetooth forum

CC2651R3SIPA: Does CC2651R3SIPAT0MOUR support Bluetooth Bonding?