SIMPLELINK-LOWPOWER-SDK: CC2651R3xx How many devices allow by bonding table in BLE stack?

Tool/software:

Hello,

May I have question about CC2651R3SIPA and TI BLE stack?

I think BLE connection can establish without pairing using bonding table in 2nd time.

I believe this function can customize in GAP Bond Manager.

https://software-dl.ti.com/simplelink/esd/simplelink_cc13xx_cc26xx_sdk/7.41.00.17/exports/docs/ble5stack/ble_user_guide/html/ble-stack-5.x/gapbondmngr-cc13xx_cc26xx.html?highlight=bonding%20table#using-gapbondmgr 

Is this correct?

If yes, How many device can allow by the table?

Is it as much as the memory capacity allows? Or is there a limit on the stack side?

Thanks,

GR