Tool/software:
Hi team,
The RGE package of the CC2340R2 has a large pad on the bottom side, referred to as pad 25. This appears to have thermal and mechanical functions, but does it also have anything to do with the RF GND?
I noticed that the other packages (RKP and YBG) both have dedicated RFGND pins. Would RF output be impacted if this pad is not actually soldered (or not soldered well)?
Thanks,
Luke
