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CC2340R5: Question about adjusting the NVS size and location in the basic_ble example for CC2340R5

Tszng Dean
Prodigy 10 points
Part Number: CC2340R5

Tool/software:

Hello,

In the basic_ble example for the CC2340R5, there is a default NVS configuration allocated for BLE usage.

I would like to know if it’s possible to reduce the size of this default NVS and adjust its memory location.

If reducing the size is feasible, what would be a recommended size?

  • 0
    TI__Mastermind 36660 points

    Hi,

    I believe you are referring to the CONFIG_NVSINTERNAL region. This region is used by the gap bond manager to handle pairing and save bonds. If your application is planning to use several bonds then I would suggest to leave this region as is. However, if you will not be bonding or if you will be using a very limited number of bonds, then you may reduce the size up to a minimum of 0x800.

    Best Regards,

    Jan