CC2651R3SIPA: Alternate PCB Layout Guidelines

user6526132

Part Number: CC2651R3SIPA

Tool/software:

Regarding the RF layout, guideline 10.4.2 in the datasheet recommends an L1-2 interlayer thickness, 4 layers, and a dielectric constant, but since I cannot design according to these recommended values, I am proceeding with the design according to guideline 10.4.4.

When designing according to guideline 10.4.4

(1) Two values are listed for L16: 0.8mm and 1.6mm thickness, but how should I design if the board thickness is other than these?

　　Currently, I am considering a board thickness of 0.8mm or 1.0mm.

(2) Can I assume that the number of layers (interlayer thickness) has no effect?

(3) In Figure 10-8, is it okay to punch out all layers except the surface layer within the red frame?

　Or should I make the same pattern as the surface layer only on the GND side of L16 (blue frame in the attached figure)?

9 months ago

0 FI 9 months ago

TI__Mastermind 21130 points

Hi,

1) What thickness can you design for? Even if the thickness is not the same as 0.8mm or 1.6mm, you can tweak the inductor value slightly to retune the antenna match. Some lab work may be required.

2) I assume this item is related to the concern in item 1

3) there must be at least one ground reference plane under the module.

Regards

0 user6526132 9 months ago in reply to FI

Prodigy 110 points

Thank you for your reply.

1) The plate thickness is 0.8mm or 1.0mm.

　Since 0.8mm=2.7nH, what happens if it is 1.0mm?

3) Which is it, ① or ②?

　The diagram shows 4 layers, but actual designs may have more than 4 layers.

Bluetooth®︎

Bluetooth forum

CC2651R3SIPA: Alternate PCB Layout Guidelines