CC2340R5: BONDING REPLACEMENT SUPPORT

Satakshi Roy

Part Number: CC2340R5

Tool/software:

Hi,

I have a specific usecase with CC2340R5. I have configured my device as the peripheral and I have set maximum number of supported bonds to 1 because I want my peripheral to bond to only 1 device. Now, after I bonded to the intended central device, if central device deletes the bond information from its memory, as peripheral also, do I need to delete bond information and then proceed for pairing with a new central? If yes, how will I know my central has deleted bond information from its memory? If no, then its alright.

5 months ago

0 Maxence Mathieu 5 months ago

TI__Expert 5000 points

Hi !

I think the BLE stack of the CC2340R5 should take care of this by itself, and once you delete the bond information, it should clear up space for a new bond. In your case, to delete a bond manually, you can call the GAPBondMgr_SetParameter function with the GAPBOND_ERASE_ALLBONDS parameter. This will remove the SNV, clearing up space for a new bond.

Here's the link to the API about the GAP Bond Manager, and the link to the User Guide about the GAP Bond Manager.

Kind regards,
Maxence

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CC2340R5: BONDING REPLACEMENT SUPPORT