CC2340R5: How to modify project setting for BGA?

Tim.JH Chen

Part Number: CC2340R5
Other Parts Discussed in Thread: SYSCONFIG

Tool/software:

The surface-mount package of our test module utilizes a Ball Grid Array (BGA) design.

Where should I modify the SDK to accommodate the BGA?

Our projet is https://dev.ti.com/tirex/explore/node?node=A__AMagareWofeA05pJETPi4g__com.ti.SIMPLELINK_LOWPOWER_F3_SDK__58mgN04__LATEST host_test.

5 months ago

0 Jan 5 months ago

TI__Mastermind 42100 points

Hi,

All changes necessary to change the device package in a project may be done through SysConfig. Within SysConfig, open Board View (on the top right) and select Use Custom Board. Afterwards, you may change the device in Device View (top right) and select the desired package.

Best Regards,

Jan

0 Tim.JH Chen 4 months ago in reply to Jan

Prodigy 20 points

Hi Jan,

Thank you for your response.

I am unable to find the BGA selection.

What should I do, or is there something else I can try?

0 Jan 4 months ago in reply to Tim.JH Chen

TI__Mastermind 42100 points

Hi,

In this case, the WCSB package would be the ball grid option. Can you try this one on your side?

Best Regards,

Jan

0 Tim.JH Chen 4 months ago in reply to Jan

Prodigy 20 points

Hi Jan,

I tried it, but an error message occurred.

What should I do for this issue?

Thanks.

0 Jan 4 months ago in reply to Tim.JH Chen

TI__Mastermind 42100 points

Hi,

My apologies, it seems that the BGA package is not yet supported in the 8.40 for some reason. This support will definitely come in the 9.10 SDK releasing soon.

That said, in the meantime we can set the package to the RGE (4x4) package and use the DIO names. The DIO numbers should match 1-1 with those used in the BGA package so the image should work.

Best Regards,

Jan

0 Tim.JH Chen 4 months ago in reply to Jan

Prodigy 20 points

Hi Jan,

How can I check the DIO and config to the project?

Thanks.

0 Jan 4 months ago in reply to Tim.JH Chen

TI__Mastermind 42100 points

Hi,

The DIOs may be configured through the PinMux settings in SysConfig and the pin/gpio mapping may be seen in section 6.1.3 Pin Diagram—YBG Package (Top View) of the datasheet

Table 6-1. Pin Attributes (RKP, RGE, YBG, Packages) contains the attributes and which peripherals are connected to each pins. I would suggest using the RGE package in sysconfig and then using the DIO numbers to match the pins to the YBG package for now.

Best Regards,

Jan

0 Tim.JH Chen 4 months ago in reply to Jan

Prodigy 20 points

Is there an older version of the SDK that supports WCSB or BGA?

Additionally, we want the project to be able to perform GapScan via BTool.

GapScan_enable

0xFE51

0 Jan 4 months ago in reply to Tim.JH Chen

TI__Mastermind 42100 points

Hi,

Unfortunately, the WCSB package is not included in the previous SDKs. You should be able to the to use the RGE package as mentioned in the previous reply and match the DIOs.

The host_test is able to receive the scan command and perform the scan through btool.

Best Regards,

Jan

0 Tim.JH Chen 4 months ago in reply to Jan

Prodigy 20 points

Is there any schedule for 9.10 SDK releasing?

0 Tim.JH Chen 4 months ago in reply to Jan

Prodigy 20 points

If we want to perform a GapScan via BTool through UART,

which pins of the minima change should we modify?

The other pins if we did not used maybe wa can delete them to resolved the error.

0 Jan 4 months ago in reply to Tim.JH Chen

TI__Mastermind 42100 points

Hi,

To use host_test with btool, the minimum pins needed are UART TX and UART RX. All other pins may be removed. If you tell me which UART pins you are using for TX and RX, i can prepare an image for you.

Best Regards,

Jan

Bluetooth®︎

Bluetooth forum

CC2340R5: How to modify project setting for BGA?