CC2745R10-Q1: How can I control the bonding process?

Peisheng Yang

Part Number: CC2745R10-Q1
Other Parts Discussed in Thread: SYSCONFIG

Tool/software:

Hi, Ti

Currently, I've enabled the bonding function in syscfg, so the device will automatically perform the bonding process once the Bluetooth connection is established for the first time. However, I now need to add our own security authentication function after the L2CAP is established. Bonding should only be allowed after the authentication is successful. Could you tell me how to intercept the bonding process and manually initiate it after I've completed the authentication?

Best regards!

Preston

4 months ago

0 Nima 4 months ago

TI__Genius 14595 points

Hello,

This setting is also controlled in syscfg. In Bond Manager in sysconfig, you should see the following setting:

By changing this, you should be able to control if the device waits for a security request, or initiates it. If you set it to wait for a security request, then you can initiate it manually in code.

Hope that helps!

Best,

Nima Behmanesh

0 Peisheng Yang 4 months ago in reply to Nima

Intellectual 660 points

Hi, Nima

I'm sorry, I may not have expressed myself clearly. For CC2745, I configured it to initiate the pairing request. Therefore, after the Bluetooth is connected for the first time, the system will automatically initiate pairing and bonding. Can I choose to initiate the pairing request, but the system does not automatically perform the bonding after the Bluetooth connection is established, and instead, I manually control to trigger the bonding? If it is possible, how can I make it not initiate the bonding, and which API can I use for the bonding operation?

Best regards!

Preston

+1 Nima 3 months ago in reply to Peisheng Yang

TI__Genius 14595 points

Hi,

I apologize for the massive delay here; I did not get a notification that you replied.

In order to accomplish what you want, you will need to remove GAPBondMgr, and handle manage it yourself by calling the appropriate GAP APIs. I don't recommend this.

GAP_Authenticate will initiate pairing.

https://dev.ti.com/tirex/content/simplelink_lowpower_f3_sdk_9_10_00_83/docs/ble5stack/ble_user_guide/doxygen/ble/html/group___g_a_p.html#ga21cd72be1c8feccc658a7b0faec167a5

GAP_Bond will create the bond.

https://dev.ti.com/tirex/content/simplelink_lowpower_f3_sdk_9_10_00_83/docs/ble5stack/ble_user_guide/doxygen/ble/html/group___g_a_p.html#gaf5996bcaf8dc6cda6263d338995eac78

Recognize that neither of those APIs should be used if GAPBondMgr is used.

What is the use-case?

Best,

Nima Behmanesh

0 Peisheng Yang 3 months ago in reply to Nima

Intellectual 660 points

Hi, Nima

We have added an authentication function to the Bluetooth connection process. Bonding can only be performed after successful authentication following the Bluetooth connection. Therefore, I need to control the Bonding process. I will attempt to use these APIs for control.

Best regards!

Preston

0 Peisheng Yang 3 months ago in reply to Nima

Intellectual 660 points

Hi, Nima

When manually calling GAP_Authenticate and GAP_Bond, how should the required parameters be filled in? Are there any examples?

Best regards!

Preston

+1 Nima 3 months ago in reply to Peisheng Yang

TI__Genius 14595 points

Hello,

Since our examples rely on using GAPBondMgr, we have no examples that call these functions directly. The required parameters will need to be filled in according to Bluetooth Core Specification. Specifically, you can find more information regarding these parameters in Vol 3. Part H Security Manager. I would start with Section 2.4 Security in Bluetooth Low Energy.

Best,

Nima Behmanesh

0 Peisheng Yang 3 months ago in reply to Nima

Intellectual 660 points

Thank you for the guidance. I will review the relevant materials.

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CC2745R10-Q1: How can I control the bonding process?