LP-EM-CC2745R10-Q1: PCB layer stack up

Shashank TS

Tool/software:

I want to know what is the layer stack up details of the CC2745 launch pad? May I know if I need to change the source matching component values if I use a different stack up?

over 1 year ago

0 Bun Kuch over 1 year ago

TI__Expert 7210 points

1. Check out our reference design: https://www.ti.com/lit/zip/swrc393 design -> Assembly Drawing -> MCU123A_mech.pdf

2. No need to change source matching values. Just change the RF trace width to compensate for the change in substrate thickness.

Best regards,

Bun

0 Shashank TS over 1 year ago in reply to Bun Kuch

Prodigy 160 points

Thank you. May I know what is the Dielectric constant of the substrate for the FR-4 used?

0 Bun Kuch over 1 year ago in reply to Shashank TS

TI__Expert 7210 points

It can vary based on the manufacturer. Please have them confirm the value, but we typically use 4.5 for simulations.

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LP-EM-CC2745R10-Q1: PCB layer stack up