CC2745P10-Q1: Add custom functionality to the bonding process

Hello,

After reading the old thread and the information you've provided here, I believe I understand the use-case better, my apologies for not suggesting this earlier!

Peisheng Yang said:

However, after internal discussions, we are now considering whether we can retain the GAPBondMgr and use your existing logic, but insert our own authentication process after connection establishment and before bonding—only allowing bonding to proceed if authentication succeeds.

Though, I should mention that bonding only occurs if pairing was successful to begin with, and from our documentation:

Bonding can enabled or disabled for any type of pairing through the GAPBOND_BONDING_ENABLED parameter, and occurs after the pairing process is complete. 

Bonding cannot occur if the pairing process did not complete successfully, since there would be no keys to store. Additionally, if the device is in the central role, you can specify a Bond Fail Action: 

However, if you wanted to pair, then have some custom authentication, and if that is complete then bond, you could do the following:

The method would be to disable bonding initially. You'd need to go into your sysconfig file and uncheck the Bonding flag. You may also want to change the Pairing Mode to wait for pairing request, so that you can do whatever custom authentication you like before the pairing is initiated (though this isn't required). 

Once the devices have paired but not bonded, you can use GAPBondMgr_setParameter to re-enable bonding, and then call GAPBondMgr_Pair to re-encrypt and bond.

The last method would be to use Out-Of-Band pairing.

Hope that helps! 

Best,

Nima Behmanesh