LP-EM-CC2340R5: OAD would fail when bonded first

Hi Frank,

Thanks for the details.

Frank(EP) Liu said:

If I don't do bond with evm first, no issue for OAD.

Since Bonds are written to internal flash, and OAD is also writing to internal flash for the onchip project I suppose this could be related.

One thing to test, could the device try to remove the Bond once it detects OAD happening? Or what if you remove the Bond first (triggered by button press), and then afterwards start the OAD?

Thanks,
Toby

Hi Frank,

Can you confirm how you are flashing the device and at which address? Have you modified your mcuboot to match the addresses used by the basic_ble project and to operate in the expected OAD scheme (on-chip, dual image, offchip)?

Best Regards,

Jan

Jan,

i don't change anything.

I follow readme.

Open UniFlash and load the files through the Program window. Flash the files as explained below:

• BLE OAD On Chip:
  • mcuboot_onchip_xxx_xxx.hex - Load Addr: AUTO
  • basic_persistent_xxx_xxx.bin - Load Addr: 0x00006000
  • basic_ble_oad_onchip_xxx_xxx.bin - Load Addr: 0x00032000

mcuboot_onchip_xxx_xxx.hex is from prebuilt image.

basic_persistent_xxx_xxx.bi is from example project "basic_persistent_LP_EM_CC2340R5_freertos_ticlang".

basic_ble_oad_onchip_xxx_xxx.bi is from example project "basic_ble_oad_onchip_LP_EM_CC2340R5_freertos_ticlang"

BR,

frank

Jan,

Any update for this issue?

BR,

frank

Hi Frank,

My apologies on the delay here. Can you try building your own MCUBoot configured for on-chip and verifying that the persistent address, app address and OAD address are set to what we expect?

Best Regards,

Jan

Jan,

I don't get  your point. I set as readme and there is no issue without binding.

• BLE OAD On Chip:
  • mcuboot_onchip_xxx_xxx.hex - Load Addr: AUTO
  • basic_persistent_xxx_xxx.bin - Load Addr: 0x00006000
  • basic_ble_oad_onchip_xxx_xxx.bin - Load Addr: 0x00032000

not sure what you want to try?

BR,

frank

Hi Frank,

Can you confirm that the app image slot configured for both persistent and mcuboot matches the 0x00032000?

Best Regards,

Jan

Jan,

I don't get your question.

• BLE OAD On Chip:
  • mcuboot_onchip_xxx_xxx.hex - Load Addr: AUTO <= file is from \simplelink_lowpower_f3_sdk_9_11_00_18\examples\rtos\LP_EM_CC2340R5\ble\prebuilt_hexfiles
  • basic_persistent_xxx_xxx.bin - Load Addr: 0x00006000 <= binary file is the built result from example project \basic_persistent_LP_EM_CC2340R5_freertos_ticlang\Release\basic_persistent_LP_EM_CC2340R5_freertos_ticlang.bin
  • basic_ble_oad_onchip_xxx_xxx.bin - Load Addr: 0x00032000 <= binary file is the built result from example project \basic_ble_oad_onchip_LP_EM_CC2340R5_freertos_ticlang\Release\basic_ble_oad_onchip_LP_EM_CC2340R5_freertos_ticlang_v1.bin

if app image, persistent, mcuboot image cannot fit in above, uniflash would show warning, right?

nvs setting in basic_ble_oad_onchip_LP_EM_CC2340R5_freertos_ticlang

BR,

frank

Hi Frank,

Thank you for reporting this. I was able to reproduce the same behavior on my side. I ran a few different tests and got the following result

1. iPhone 15 Plus iOS 18.5 - No Bonding - OAD Success

2. iPhone 15 Plus iOS 18.5 - Bonding - OAD Reset Failure

3. Pixel 9 Pro XL Android 15 - No Bonding - OAD Success

4 Pixel 9 Pro XL Android 15 - Bonding - OAD Success

This seems to be an issue specifically with the iOS version of the mobile app. I will file a ticket to get this addressed ASAP.

Best Regards,

Jan

Jan,

any update?

BR,

frank

Jan,

I turn off IOS BLE, restart the app and power cycle the evm. I repeat step 5. It still fails at step 6.

The way can fix this is to forget the device "persistant_app". By the way, I only bond with "Basic_BLE". The App\ iPhone would change it when I process the OAD.

So, any method to avoid this?

BR,

frank

Hi Frank,

I believe this has to do with how the iOS device handles caching. I have made a note of this in  the ticket filed for this issue.

Best Regards,

Jan

Jan,

if customer doesn't really need to bonding the device, they just want to have passcode to limit the access from any central device.

Is that ok to uncheck above or other suggestion?

It works for OAD.

BR,

frank

Hi Frank,

That should be enough to save the bonding process but retain the pairing procedure.

Best Regards,

Jan