Other Parts Discussed in Thread: SYSCONFIG, CC2640
Tool/software:
We are currently working on a project that involves communication between a thermostat and a lock over BLE. The thermostat architecture includes two controllers:
- An STM microcontroller handling HVAC operations.
- A TI CC2640F128 BLE chip dedicated to BLE communication with the lock. The STM and TI controllers communicate over UART.
We successfully achieved BLE pairing and bonding functionality using the CC2640F128 chip. However, we are now transitioning to the CC2640R2F BLE chip and want to achieve the same pairing and bonding functionality.
We understand that the CC2640F128 and CC2640R2F use different BLE stacks, and we have used the respective stack for the R2F chip. Despite this, pairing and bonding do not appear to be working as expected.
Could you please assist us in identifying the necessary configurations or changes required to enable successful pairing and bonding on the CC2640R2F chip?