Part Number: CC2745R10-Q1
Hi
I need to pair+bond CC2745 with CC2340 in a factory environment with lot of Radio Interferences.
When tried to perform pairing with Justworks, I see a lot of retries and failures.
I came across Importing Bonding Information https://dev.ti.com/tirex/explore/content/simplelink_lowpower_f3_sdk_9_12_00_19/docs/ble5stack/ble_user_guide/html/ble-stack-5.x/gapbondmngr-cc23xx.html#import-bonding-information
I want to know if I can generate the contents of struct gapBondNvRecord_t (as per SDK version 9.12)
gapBondRec_t *pBondRec;
gapBondLTK_t *pLocalLtk;
gapBondLTK_t *pDevLtk;
uint8_t *pIRK;
uint8_t *pSRK;
uint32_t *pSignCount;
gapBondCharCfg_t *pCharCfg;
on a PC with relavent crypto functions.and use GapBondMgr_writeBondToNv on both BLE Central and Peripheral .
Since a bonding information is present , the pairing flow would be skipped and the link would be encrypted with populated data.
Kindly let me know if this approach works