Part Number: CC2652P
Hi,
We are working on your CC2652 chip. Specifically, the application is based on the BLE stack simplelink_cc13xx_cc26xx_sdk_6_10_00_29, starting from the multi_role example project.
We have encountered an abnormal behavior on some devices: BLE works correctly, pairing is successful, but the bonding phase fails on our device side (on the other side the device seems correctly bonded).
After performing a flash dump comparison between a working device and a non-working one, we noticed the following difference:
At address 0x4A000 (second page of NVOCMP_nvHandle), the non-working device shows a value of 0x78 = FULL, even though the page is completely filled with 0xFF.
It seems the code cannot recover from this state, and no bonding are accepted.
Is it possible for the memory to be in this condition during normal operation? Are there any known issues related to this? How can we prevent this situation or at least restore proper functionality?
Regards,
