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CC2340R5: Flash Partition Corruption During OAD on CC2340R53

Part Number: CC2340R5
Other Parts Discussed in Thread: SYSCONFIG

Hi Team,
 
We are using the CC2340R53 in our product, and as part of our product requirements we have created a 2 KB (0x800 bytes) flash partition dedicated solely for storing device configuration data.
We have updated the linker (.cmd) file as well as SysConfig to accommodate this custom partition.
 
The partition works correctly under normal conditions. However, when an OAD update is in progress and the device is powered off, we occasionally observe corruption in the device configuration partition.
This issue appears intermittently and only in scenarios where power is removed during the OAD process.
 
Below are the details of all flash partitions for reference:
 
MCU Boot:
  Start = 0x00000
  End   = 0x03FFF
 
Persistence Application:
  Start = 0x04000
  End   = 0x36FFF
 
User Application:
  Start = 0x37000
  End   = 0x7B7FF
 
Device Config Partition:
  Start = 0x7B800
  End   = 0x7BFFF
 
NVS:
  Start = 0x7C000
  End   = 0x7FFFF

The SDK version which we are using is SimpleLink Low Power F3 SDK (version 8.10.01.02 .
 
Could you please help us understand why this corruption occurs and suggest the correct way to protect or handle this configuration partition during OAD?
 
Thanks,
Vatsal
 
 
  • Hi Vatsal,

    Thank you for reaching out. Can you confirm that you have reserved the new region of flash in all three projects (MCUBoot, Persistent, and app) in both the syscfg and in the linker file? Also can you ensure there is no overlap? BLE has the last few pages of flash automatically reserved for storing bonds just want to make sure we are not overlapping any regions.

    Best Regards,

    Jan