Using Secondary EM header on LM3S9B96 EM2 Expansion Board

Thank you very much.

I'll check to see if I can make it works

Hello Miguel,

Nice hint you have given to us.

You mentioned we need to think of the contention of the two RFs.

With populating the R7 jumper, how can we "see" the "RF2" from software wise?

I didn't find out any tutorial about setting up the second RF.

Question list looks like:

1. I have the scenario that I need to run two CC2256X(PAN1323ETU) in parallel, how should I proceed?

2. Why there is no HFP demo but only SPP and A2DP demos?

3. In principle, if I want to rerouting the audio. i.e., routing HFP audio from one Bluetooth chipset to the other Bluetooth chipset, is it possible to fulfill?

4. Is the CPU powerful enough to support two HFP stacks at a time(one stack for each Bluetooth chipset)?

I look forwarding to listening your advice and expertise.

Cheers,

mh

Hi,

Please find the answers in order :

1. Right now, we don’t support two BT stack instances on the same processor. Please contact SSO directly for a custom version. HW-wise, each PAN1323 has to be connected to a different host UART.

2. Due to low demand, we don’t have HFP available in Tiva C yet.

3. It is possible, but you need to be Master on both links.

4. Yes, but refer to 1.

Regards,
Gigi Joseph.

Hello Joseph, 

I am exciting to get your reply!

regarding answers your gave for question #1 and #3, I have further questions:

1. Could you provide us the proper hardware to adapt the use scenario like audio routing between/among multi-BT chipsets? If I didn't get your meaning wrongly, you meant "LM3S9D96 + 2 PAN1323ETU" wouldn't work for the scenario I said above from HW aspect. ps: I learned that the UART1 is the only channel for both RF connecters:http://www.ti.com/lit/ug/spmu175/spmu175.pdf, and it contradicts to the statement you answered.

3. Give we connect AUD_IN/AUD_OUT/AUD_CLK/AUD_FSYNC properly, what do you mean by to be master on both links? In fact, I am quite confused by the character assignment in this case. In my first assumption, I assume smart phone as a HFP AG(master) and one BT module(module#1) connected to the smart phone as a HFP(slave). Then the other BT module(module#2) which has audio connection with module#1 should be HFP AG(master), since module#2 will connect with a headset(slave). Diagram like:

smart phone <--HF-->  BT#1 <--AUD->  BT#2 <--HF-->  Headset

If so, then BT#1 is a slave and BT#2 is a master, am I correct?

again, thanks in advance and sorry about so heavy text.

Cheers,

mh

Hi,

1. LM3S9D96 + 2 PAN1323ETU -> wouldn't work from a sw point of view as two BT stack instances on the same processor is not supported. Like I said, please contact SSO for a custom version.

2. I was assuming a bluetooth connection between BT#1 & BT#2, and hence wanted BT#1 to be master in the BT#1 <-> smart phone ACL link and the BT#1 <-> BT#2 ACL link.

Regards,
Gigi Joseph

Hello Joseph, great to hear your confirmation!

Sounds SSO will be in charge of Bluetooth software of TI. Does SSO has such community like TI?

Cheers,

mh

Hi MH,

You can use this same forum for any queries related to SSO stack.

Regards,
Gigi Joseph.