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BLE v1.3.1 bonding changes

smitesh mali1
Intellectual 900 points

In BLE stack v1.3.1 following thing is written in release note 

For GAP central role applications, the bond manager now properly handles
cases in which the peripheral device has erased previously stored bonding
infomration.

I would like to know what was the problem earlier in v 1.3 and what is the change in new version v1.3.1

Regards,

Smitesh mali

  • 0
    Guru 22270 points

    Hello Smitesh,

    I don't know the reason for sure, but I would suspect it had something to do with either the the value being overwritten in RAM or an issue with the NV_Write.

    Since the problem has been corrected, is there an issue with 1.3.1 why you can't use that version with your application with the problem fixed?

    Thanks,