Hi,
I am using the BLE stack 1.3 on CC2541
I was able to find that the following NVIDs are used by the BLE stack:
** @defgroup BLE_NV_IDS BLE Non-volatile IDs
* @{
*/
// Device NV Items - Range 0 - 0x1F
#define BLE_NVID_IRK 0x02 //!< The Device's IRK
#define BLE_NVID_CSRK 0x03 //!< The Device's CSRK
#define BLE_NVID_SIGNCOUNTER 0x04 //!< The Device's Sign Counter
// Bonding NV Items - Range 0x20 - 0x5F - This allows for 10 bondings
#define BLE_NVID_GAP_BOND_START 0x20 //!< Start of the GAP Bond Manager's NV IDs
#define BLE_NVID_GAP_BOND_END 0x5f //!< End of the GAP Bond Manager's NV IDs Range
// GATT Configuration NV Items - Range 0x70 - 0x79 - This must match the number of Bonding entries
#define BLE_NVID_GATT_CFG_START 0x70 //!< Start of the GATT Configuration NV IDs
#define BLE_NVID_GATT_CFG_END 0x79 //!< End of the GATT Configuration NV IDs
/** @} End BLE_NV_IDS */
Does it mean that all other NVIDs are available for the application?
Where can I find the available memory IDs table? I can't find it in the software developper guide.
Thank you for your help.
Grégory
