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Custom board with MSP430 and CC2564 failing when heated.

Other Parts Discussed in Thread: CC2564

Hi TI,


We've just started a production run of units with the MSP4305348A and the CC2564 and we've got 5 out of 100 that seem to be affected by heat. We have them advertising and stick them under the hand dryer and they stop broadcasting. We then put them in the fridge for an hour and they work solidly for a while. The other units have been tested as well and seem to be fine.

Has this been seen before? When it stops broadcasting we haven't discovered yet whether the MSP or the BT chip is not responding or another component on the board failing, but would the bluetooth chip stop advertising if the the MSP stops communicating? Or would the connection fail instead?

Regards,

Barak

  • Hi Barak,

    If the MSP stops communicating, the CC2564 should not stops advertising, unless it receives some data and it would require the host to process it.  

    I hope you are not going beyond the Operating temperature range of the module, which can be found in the module datasheet.

  • I doubt it we are going beyond the operating temperature of the device, the unit will stop broadcasting after it is cooled in the fridge for an hour and then left to run for 10 minutes at room temperature. They only need to be placed in heat for a minute or two to bring the issue on. With other units we do not see this behavior.

    Thanks for the info, the hardware guys are looking at the failing boards now.

  • I have been asked to check if there have there been any batch issues with either the MSP430 or the CC2564 relating to devices failing at higher temperatures?

  • Hi Barak,

    I have not heard of any. Anyway I am also checking it internally, I will get back to you on this. 

  • Hi Barak,

    There shouldn’t be any problem with CC2564.

    Since you are not sure which unit is failing, whether it’s the MSP or the BT, I would recommend you to take a “good” BT unit, and put it on a “bad” MSP platform.

    Conduct this test several time. This will tell us which part is failing.

    After that if you still think the problem is with CC2564, Please provide below information

    1. Concrete numbers on the heat, duration, cool, temperature …
    2. What is the model/revision/part number of the device you are using
    3. Are you using QFN device, If yes what is the revision?
    4. how fast is the change in temp?
  • Given that this is a custom design that works intermittently, is it possible you have issues with the temperature affecting the physical contact between the parts? BGA balls are notorious for cracking if something is wrong during assembly. The heat and cold cycles might make the contact of the balls with the board unreliable.

    You didn't mention if any of the parts are BGA, but that would be my first suspicion (an assembly related issue). I recommend that you x-ray the boards and check for cracked balls and other issues. It is unlikely that the MSP430 or CC256x will fail due to rise in temperature, unless you are violating the specs (doesn't sound like you are).

    One thing you can do is to run some diagnostic software on the product to try and see whether there is a broken connection between devices, but this won't help if it's the MSP430 that is suffering the issue.


    Regards,
    Gustavo