We are using CC2564RVMT and MSP430F5438AIZQW as a Bluetooth interface. We are experiencing about a 10% failure rate in production, with the Bluetooth interface failing under moderate to high heat conditions (35 to 45 degrees C). If the unit is cooled it works perfectly.
Our software debug shows that the Bluetooth stack in the MSP reports HWI hardware errors (06 and 09). When these failures occur and eventually the processor either stops or no longer executes valid code our trace stops.
We've also noticed there is a new Bluetooth chip available CC2564B. The chip we use is CC2564. It is no longer recommended for new designs according to this web page, http://processors.wiki.ti.com/index.php/CC256x_Downloads.
Should we move to this chip? Would it help with the problem we are experiencing?
Anyone else experiencing heat related failures on CC2564?
