The CC2564B QFN package IC's thermal pad center is about 0.17mm shift from the IC package center as shown in datasheet. The thermal pad center is 0.17mm toward South from IC package center.
However, the BT-MSP-AUDSINK design board file, "board file BT-MSP-AUDSINK_v1_1.brd" shows the themal pad center is toward North from IC package center. Which one should be correct? Should we follow datasheet or design gerber file?
