Is it possible to use BLE Stack for both images?

Dmitry Cheremisin

Other Parts Discussed in Thread: CC2541

Hi, original TI OAD provides separation of memory into two parts (plus BIM), so in CC2541 chip it will be 128k of memory, there 124k bytes are for BLE Stack(Libs, OSAL, HAL, etc) and only around 4k remains for user application, and it's quite low value. Stack includes in both images by default, so inside the chip you'll get 2 exactly the same parts of memory (ti stack), but what if is it possible to use only one part? I mean to load stack one time during first chip programming like BIM and after that just update application part through OAD?

I thought about that and made a picture of memory partition, TI BLE Stack cannot be near BIM because it will be unreachable for ImageB, so I put it into middle, hope everything will be clear from my picture.

P.S. I read document about OAD and I didn't find much useful in that situation.

over 11 years ago

0 Willis1 over 11 years ago

TI__Genius 17975 points

Sorry, we do not support this architecture on CC254x, though we do have future plans for this type of setup.

0 Dmitry Cheremisin over 11 years ago in reply to Willis1

Intellectual 440 points

Thanks for your reply, I know what TI does not providing support of such configuration. I just was curious, is it possible to modify a linker file (in IAR) on this task? I don't understand all memory specifics of 8051 and guessing is there a sense in trying to do this.

<<though we do have future plans for this type of setup>>
That's great, and when to expect a results? )

Regards

0 Raj Sarkar over 11 years ago in reply to Dmitry Cheremisin

Intellectual 265 points

Good to know TI has plans for this in the future.. updating of only the application code is very useful during field tests. Will it be possible to do this with any of the cc2541 (256kb) boards that we have already given our customers, if this type of partition is updated?

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Is it possible to use BLE Stack for both images?