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PCB footprint for CC2640

Tyler Gage
Prodigy 40 points

Other Parts Discussed in Thread: CC2640

I have a question regarding the layout of a CC2640 chip, specifically the RSM QFN package. I know typically the thermal pads should contain multiple vias for heat dissipation. I was wondering, do these vias have anything to do with RF performance of the device or is it strictly heat dissipation. I am doing a project were we want to mount a CC2640 on a two layer PCB but because of what is on the opposite side of the PCB, it is not possible to place vias on the thermal pad. I was wondering if we can get away with mounting the CC2640 device on a two layer PCB without vias in the thermal pad.

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    TI__Guru** 106705 points

    Hi Tyler,

    As you correctly point out, the vias in the thermal pad are not for heat dissipation on the CC2640 (it is a low power part, right). However, these are vital for the RF performance. The vias ensure a low impedance ground return path between the external RF circuitry and the chip which is critical for good RF performance. I would highly recommend you to re-arrange some components on your board so you can place at least some vias in the pad.

    Cheers,
    Fredrik