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difference between different build configuration like FLASH_ONLY_BUILD , FLASH_ROM_BUILD etc.,.

Other Parts Discussed in Thread: CC2650

Hi,


There are different symbols for different build configurations

 *        CCxxxx:            Device Name (e.g. CC2650).
 *         FLASH_ONLY_BUILD:  Build full BLE stack in flash only memory.
 *         FLASH_ROM_BUILD:   Build Flash portion of BLE stack to work with ROM code.
 *        ROM_BUILD:         Build ROM portion of BLE stack.
 *        COMMON_ROM_BUILD:  Build of common ROM code.
 *        TEST_ROM_IN_FLASH: Build ROM code in Flash memory to test.
 *        ICALL_STACK0_ADDR: Start address of flash only and flash ROM builds.


There is very less information about there symbols in the software development guide.

Can you explain about those symbols so as to understand which symbols must be used for which type of build?

  • Hello,

    The only supported protocol stack configuration is the FLASH_ROM_BUILD which uses the stack in flash & in ROM (Controller). The ICALL_STACK0_ADDR define is detailed in the developer's guide (SWRU393).

    Best wishes
  • Hello,


    Thanks for the reply. Can you explain "only supported protocol stack configuration" which is FLASH_ROM_BUILD? What does this FLASH_ONLY_BUILD configuration do?

    Actually I'm trying this because I want to reduce the stack size with all the features intact(like gapbondmgr etc. ), and this FLASH_ONLY_BUILD configuration is reducing the stack size by 10k bytes. Can you please explain why other configurations won't work?

    Thanks,

    Sarat