Hi,
I need to extract the LTK from CC2650 to use in TI RFSniffer tool.
I can see the ltk is used in gapbondmgr.c and could be extracted breaking the functions in this c-file, but gapbondmgr.c is used in the STACK scope, so debugging is not possible for me, or is it?
How can I extract the LTK during bonding/rebonding when in debug?
I use ble_sdk_2_02_00_31_setup.exe and the Simple_Peripheral example.
Best Regards,
Mathias