CC2650 - Memory Usage question

Mizanur Chowdhury

Other Parts Discussed in Thread: CC2650, BLE-STACK, CC2640, CC2640R2F

Hello Team,

We want to add OAD support and have concerns about available memory on CC2650.

We are writing the code in CCS v.6.2.0.00050 using BLE-STACK V2.2.1, the project is based on Project 0.

Concerning limited memory availability we switch off the OSAL_SVN flag during compile which allows us to free extra space for OAD. Is it true that some key functions wouldn't be working in this case?
Questions:
1) How can we reduce space, occupied by the Stack itself?
2) How can we reduce the size of TI-RTOS and the program itself?

Best regards,

Mizanur

over 9 years ago

0 Nathan Siegel over 9 years ago

TI__Genius 10980 points

Hi,

OSAL_SNV must be set when using GAP_BOND_MANAGER.

The OAD User's Guide covers some ways to decrease the size of the image. Are you doing on-chip or off-chip OAD?

-Nathan

0 Mizanur Chowdhury over 9 years ago in reply to Nathan Siegel

TI__Genius 17270 points

Hello Nathan,

We are doing on-chip OAD.
Section 5 of the CC2640 BLE OAD User's Guide suggests to downsize the BLE Stack and/or reducing the number of SNV pages. No further description on how to downsize the stack or how to reduce the number of SNV pages.

Can you point me to any documentation that might help?

Thanks,
Mizanur

0 Mizanur Chowdhury over 9 years ago in reply to Mizanur Chowdhury

TI__Genius 17270 points

Hello Nathan,

We will use off-chip OAD.
We would like to use GAP_BOND_MANAGER and off-chip OAD at the same time, but there’s space available just for one of them.

Thanks,
Mizanur

0 Nathan Siegel over 9 years ago in reply to Mizanur Chowdhury

TI__Genius 10980 points

Hi,

Off-ship OAD will allow you more space for the image. It also looks like you may be looking at an older OAD User's Guide or the wrong document. Section 5 does not discuss the stack size. Section 8 deals with off-chip OAD, and section 9 deals with on-chip OAD.

-Nathan

0 Mizanur Chowdhury over 9 years ago in reply to Nathan Siegel

TI__Genius 17270 points

Hello Nathan,

Could you please assist in answering questions below?

1. How is it possible to use off-chip OAD and GAP_BOND_MANAGER simultaneously?

2. There isn't enough memory on chip.How could we reduce TI-RTOS and BLE stack size?

Best regards,

Mizanur Chowdhury
Mass Market Field Application Engineer
North East Europe (Czech, Latvia, Lithuania, Poland & Slovakia)
TEXAS INSTRUMENTS

0 Nathan Siegel over 9 years ago in reply to Mizanur Chowdhury

TI__Genius 10980 points

Hi,

1. It is possible to use both, but GAP_BOND_MANAGER requires OSAL_SNV=1 or 2, which decreases the space that is available.

2. I would suggest switching to the CC2640R2F. This chip allows for more memory for on-chip OAD, and it should also help you with problem 1. You can find the software stack that runs on this device here: www.ti.com/.../SIMPLELINK-CC2640R2-SDK. Please see the sticky post on the main page of this forum for more details.

-Nathan

0 Mizanur Chowdhury over 9 years ago in reply to Nathan Siegel

TI__Genius 17270 points

Thanks Nathan.

BR,
Mizanur

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CC2650 - Memory Usage question