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LMX9838 get really hot and breaks

Good evening
I found Your e-mail on e2e.ti.com. Could you help me with my problem with LMX9383.
I used it in one device in different versions of my device. Some time it work fine, but some of LMX after some time get fail. I mean it get hot and I can't send any data or command to LMX from PIC32, but can see lmx from other device through Bluetooth.

I'm doing all like at the datasheet. But have two different things: OP5 (pin25) go to GND and do not use Crystal Oscillator.

Thank you for your consideration,

Aleksandr

  • Hi Aleksandr,

    Your query has been assigned to the relevant expert. We will get back to you soon.

    Best regards,
    Vihang
  • Hi Aleksandr,

    Thank you for addressing this problem in the TI E2E Community Forum.

    Customers had similar problem on LMX9838 device in the past. Our failure analysis verified and confirmed the physical root cause to be open/short failure due to melted solder bump. In this case, the customer should verify core temperature of the LM9838 part during their reflow process to verify recommended temp is not exceeded. Additional recommended actions are also documented below.

    • MSL controls (MSL4 device)
    • Dry bake before use
    • Solder profile study with thermocouples at device location

    Please implement controls based on above review.

    Thank you,
    Dennis