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CC2640R2F: Balun and CC2640R2F (BGA package) question ?

Fu Luo
Intellectual 440 points

Part Number: CC2640R2F
Other Parts Discussed in Thread: CC2650

Hi there
I have a question about the connection between Balun and CC2640R2F (BGA package).  The Murata Balun-LFB182G45BG5D920 has two balanced inputs, BA1 and BA2. The CC2640R2F has two RF  differential outputs RF-N and RF-P. 
There are two connection methods. 
Method I: RF-N connects with BA1 ; RF-P connects with BA2
Method II : RF-P connects with BA1 ; RF-N connects with BA2. 
Are these two methods identical ?
Thank you and I am looking forward to hearing back from you. 
Best regards
Fu
  • 0
    TI__Guru** 106705 points
    Hi Fu,

    The WCSP package has only been characterized for single ended operation. I would recommend following the reference design here: www.ti.com/.../swrc336

    Regards,
    Fredrik
  • 0 in reply to Fredrik K
    Intellectual 440 points

    Hi Fredrik

    Thank you for your email. I checked swrc336 reference design. Unfortunately, the board size right now is really tiny. There is no space for discrete components and PCB antenna. 

    Thus, we was asking the question about the CC2640R2F ( BGA package) + balun + chip antenna solution which we used for CC2650. 

    For the chip level design speaking, are the CC2650 and CC2640R2F having the same RF core?  and if we just talk about CC2640R2F, are different packages

    (VQFN (48), VQFN (32), DSBGA (34)) having the same RF IC design in it ?

    Thanks and looking forward to hearing any advice back.

    Best

    Fu

  • 0 in reply to Fu Luo
    TI__Guru** 106705 points

    Hi Fu,

    The layout will not be reduced by replacing  the 4 (or 3) 0201 components used in the RF match with an integrated balun which is 0603 size.

    You can of course implement the design on a smaller board, and the PCB antenna can be replaced by a chip antenna.

    It is the same RF core.

    Regards,

    Fredrik