Hi All,
I am usnig Ble stack version v3.0.1 (C:\ti\simplelink_cc2640r2_sdk_1_00_00_22) along with cc2640R2F chipset.
Example Project used : C:\ti\simplelink_cc2640r2_sdk_1_00_00_22\examples\rtos\CC2640R2_LAUNCHXL\blestack\simple_peripheral
uint32_t passkey = 0; // passkey "000000"
uint8_t pairMode = GAPBOND_PAIRING_MODE_WAIT_FOR_REQ;
uint8_t mitm = TRUE;
uint8_t ioCap = GAPBOND_IO_CAP_DISPLAY_ONLY;
uint8_t bonding = TRUE;
GAPBondMgr_SetParameter(GAPBOND_DEFAULT_PASSCODE, sizeof(uint32_t),
&passkey);
GAPBondMgr_SetParameter(GAPBOND_PAIRING_MODE, sizeof(uint8_t), &pairMode);
GAPBondMgr_SetParameter(GAPBOND_MITM_PROTECTION, sizeof(uint8_t), &mitm);
GAPBondMgr_SetParameter(GAPBOND_IO_CAPABILITIES, sizeof(uint8_t), &ioCap);
GAPBondMgr_SetParameter(GAPBOND_BONDING_ENABLED, sizeof(uint8_t), &bonding);
Registered the call back for pairing and Bonding state callback
// GAP Bond Manager Callbacks
static gapBondCBs_t simpleBLEPeripheral_BondMgrCBs =
{
NULL, // Passcode callback (not used by application)
pairStateCB // Pairing / Bonding state Callback (not used by application)
};
static void pairStateCB(uint16_t connHandle, uint8_t state, uint8_t status)
{
if (GAPBOND_PAIRING_STATE_BONDED == state)
{
enqueue the event();
}
}
So i am expecting the callback pairStateCB with the state GAPBOND_PAIRING_STATE_BONDED after the pairing and bonding completed up on the first connection.
But for the first connection the state is coming as "GAPBOND_PAIRING_STATE_STARTED" and then if we disconnect and connect again then only getting the state "GAPBOND_PAIRING_STATE_BONDED". in the call back pairStateCB.
but i need that call back with the state "GAPBOND_PAIRING_STATE_BONDED" in the first connection after bonding success
please provide your suggestions.
