Part Number: CC2650
Other Parts Discussed in Thread: BLE-STACK
Tool/software: Code Composer Studio
Good morning,
we have 1000 PCB in production using CC2650 with a FW developed using:
- Compiler version TI v5.2.6
- TI-RTOS 2.13.0.06
- BLE stack v2.1.1
- In our FW we have:
- OSAL_SNV=1
- GAP_BOND_MGR
- FEATURE_OAD
We are using the internal flash page 0x1D000-0x1F000 from BLE_NVID_CUST_START 0x80 to store some values we need in a not volatile memory using osal_snv_write/read APIs.
We found that after an OAD the osal_snv_write API is returning SUCCESS but after a power cycle the osal_snv_read does not return SUCCESS.
On the opposite if after the OAD we perform another power cycle everything is working fine, both osal_snv_write/read are returning SUCCESS and we can perform all the power cycles we want with the not volatile memory working perfectly fine.
It looks like the internal flash is locked or in some protection mode after an OAD. We saw the same behaviour after a manual flash trough JTAG: we need another power cycle to be able to use the not volatile memory correctly.
Can you please let us know if we can do something for this issue? Thank you very much for your support.
Kind Regards,
Simone Frau

