CC2640R2F: Wafer scale bump pitch?

Christopher Gates

Part Number: CC2640R2F

After looking through all of the online and pdf documentation I have been unable to find the bump *** for this device on the wafer scale packaging. I did find a good pdf on WSBGA packages in general, but I was unable to find specifically what the pitch is for the cc2640r2f.

Interestingly in the datasheet where pitch is normally called out with the package information, they dont list pitch!

Thanks

over 9 years ago

0 Christopher Gates over 9 years ago

Prodigy 60 points

odd... this forum replaced the word "pitch" with "***".

0 Fredrik K over 9 years ago in reply to Christopher Gates

TI__Guru** 106705 points

Hi Christopher,

The drawing in the datasheet clearly says 0.4 mm both horizontally and vertically.

Cheers,
Fredrik

0 Christopher Gates over 9 years ago in reply to Fredrik K

Prodigy 60 points

Ahh I thought you had it until I checked the datasheet again (the TI server was down for awhile). The section you are referencing is 4.7 which is for the RSM package not the wafer scale BGA package which is in section 4.5 "YFV". And unlike section 4.7 it doesn't bother to give a bump pitch. The datasheet can be found here:

0 Fredrik K over 9 years ago in reply to Christopher Gates

TI__Guru** 106705 points

Nope, I am referring to the mechanical data section on page 60.

0 Christopher Gates over 9 years ago in reply to Fredrik K

Prodigy 60 points

ahhh thanks. Don't know how I missed that.

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CC2640R2F: Wafer scale bump pitch?