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RTOS/CC2650: TI BLE Stack - Bonding Information

Marc Typke
Prodigy 90 points

Part Number: CC2650

Tool/software: TI-RTOS

Hello,

I am using the CC2650 using the TI-BLE Stack (latest release), when using BLE my custom peripheral firmware is based on the sensortag-firmware. I have issues bonding a 3rd party device, to whichs internals i have no access. I have the following questions:

1.) How do I generally get information in the application about pairing/ bonding attempts?

2.) How do I access error states/ reasons why bonding was rejected on application level? I tried to use the pfnPairStateCB_t function in gapBondCBs_t, but the hook was never called.

3.) How do I access the information on application level about bonded devices, or how do i erase this information without flashing the stack to the device again?

Kind Regards

Marc Typke