Part Number: SIMPLELINK-CC2640R2-SDK
Hello,
I'm working on multirole project on stack simplelink_cc2640r2_sdk_1_40_00_45, XDC tools 3.50.4.43 and cc2640r2f custom made sensortag devices.
I'm trying to do offchip oad using ble5_bim_oad_offchip_cc2640r2lp_app and multi-role project.
I have made OSAL_SNV=0 in Stack library and commented
/* Include GAP Bond Manager */
/* -DGAP_BOND_MGR */
in build_config.opt.
After making these changes I'm able t do OAD on the device but after OAD the device is not restarting with the new OAD file.
It'll still have the old file which i had debugged and put on it.
Is this due to commenting the GAP Bond manager?
Please advice, thanks.
