Tool/software: TI-RTOS
Hi,
Stack used : v3.1.1 (SDK version 1.50.58)
Device : CC2640R2F.
Testing App : nRF Connect (Nordic semiconductor).
In my project i have 4 services with Bonding and Encryption enabled and 2 services having Extended MTU size of 65bytes.
If I use iOS and android phones as central device, the heap memory usage is more during the connection time (bonding+connection) (6K approx).
But if i use the launch pad with Host test program as a central device , the heap memory usage is very less during the connection time(bonding+connection) (approx 3.8K).
Since i am using the same peripherals device, why the Heap memory consumption is more for iOS and android phone?
Please provide some suggestions.
Thanks and Regards,
Jayachandran R