hi to all,
i am developing a device with cc2540 and i want use bond feature of ble stack, i want use cc2540 as central device, bonding feature work fine except that it toke different time to bond in each time, for example it take 3sec one time and 10 sec for next time to bond, now i want know that there is logical reason to different bonding time and also there is anyway to reduce time that required for bonding.
thanks.
