This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

CC2642R: On chip OAD

Part Number: CC2642R
Other Parts Discussed in Thread: BLE-STACK

Hi,

I'd like to know the plans for on chip OAD for the CC2642R.   Is it currently available?  If not, when can we expect it?

This is infrastructure that I'd like to include as early as possible during project development.    I am currently in HW layout, and currently seeking guidance whether or not I should plan for external flash.   

Do we know what the maximum app+stack size will be permissible for on chip OAD?     Any app note or end user experiences would be helpful.

Thank you!

  • Hello,

    We do not currently have an on-chip OAD solution available for CC26x2 at this time that uses BLE.
    This is something that is currently being worked on by our R&D teams. You can expect it to be released this year in 2H 2018.

    It will use a similar mechanism to the existing solution in place for CC2640R2, but instead of ICall split image it will use the stack library approach.
    We do not have size benchmarks available at this time, as the feature is currently being developed.
    As soon as we have something available, it will be published as part of the BLE-Stack OAD User's Guide and the sample application readmes.