Other Parts Discussed in Thread: CC2650
Hello,
I am developing a product that has a CC2640R2F. This product is a slave module to another device that has a Nordic Bluetooth chip for its wireless communication. I am struggling to get the CC2640R2F to make a secure connection with the master device. The two will pair, but after taking a few sniffer examples, it was determined they try to secure connect and always end up failing the secure and failing back on the legacy connection. There are other peripheral devices in our ecosystem that are also Nordic based and able to connect to the central device LESC with no issue, which leads me to believe there is something on the TI side that is not configured or working as intended. Below is a copy of my initialization of the BLE connection on the TI application.
Any advice and help is greatly appreciated.
I am using cc2640r2_sdk_1_30_00_25. The application is based off of the simple peripheral example.
// Setup the GAP Bond Manager for "just works" with LESC
{
uint32_t passkey = 0; // passkey "000000"
uint8_t pairMode = GAPBOND_PAIRING_MODE_WAIT_FOR_REQ;
uint8_t mitm = FALSE;
uint8_t ioCap = GAPBOND_IO_CAP_DISPLAY_ONLY;
uint8_t bonding = TRUE;
uint8_t gapbondSecure = GAPBOND_SECURE_CONNECTION_ONLY;
GAPBondMgr_SetParameter(GAPBOND_DEFAULT_PASSCODE, sizeof(uint32_t), &passkey);
GAPBondMgr_SetParameter(GAPBOND_PAIRING_MODE, sizeof(uint8_t), &pairMode);
GAPBondMgr_SetParameter(GAPBOND_MITM_PROTECTION, sizeof(uint8_t), &mitm);
GAPBondMgr_SetParameter(GAPBOND_IO_CAPABILITIES, sizeof(uint8_t), &ioCap);
GAPBondMgr_SetParameter(GAPBOND_SECURE_CONNECTION, sizeof(uint8_t), &gapbondSecure);
GAPBondMgr_SetParameter(GAPBOND_BONDING_ENABLED, sizeof(uint8_t), &bonding);
}
