Other Parts Discussed in Thread: LAUNCHXL-CC26X2R1
Hi team,
Customer plans to develop the module board with CC2652R. I received some inquiries about CC2652R implementation as follows.
1. VDDR Decoupling Capacitors size
According to Schematic/BOM of LAUNCHXL-CC26x2R1 Design Files (https://www.ti.com/lit/zip/swrc346), we can see that CERAMIC Capacitors (Size:1005M). Due to reduce the board size, customer would like to use CERAMIC Capacitors (Size:0603M). if all parameters of this small CERAMIC Capacitors is same, would you consider that customer is able to use it? , if there are good CERAMIC Capacitors (Size:0603M) which TI recommends, would you share this information, please?
2. Regarding GPIO pins (DIO_2, DIO_3, DIO_2, DIO_3, DIO_18, DIO_19), What is the Capacity value which those pins have? I’m not sure if TI has this answer. however, could you elaborate it, please?
3. Soldering temperature condition
Customer is looking for Soldering temperature condition. As far as I checked, I found the following document. Would you think this document is available for CC2652R device? if there is any helpful document, could you share this information, please?
Best regards, Miyazaki